FS2000 Micro-Mesh - 5 in. No Hole Loop Variety Pack
Micro-Mesh - 5 in. No Hole Loop Variety Pack
THE HIGHEST GRIT SANDING PRODUCT
All types of MICRO-MESH are manufactured utilizing Ultra-Flex technology. Each type is long lasting, cushioned, extremely flexible, and re- useable. The Ultra-flex properties of MICRO-MESH allows it to conform to shapes conventional products cannot, giving you additional finishing options. Sheets with pressure sensitive adhesive backing can be ordered so that you can cut the MICRO-MESH to specific shapes, allowing you to adhere it to most any polishing device.
All formats are made with large, very uniform crystals that recede into the Ultra-Flex matrix as pressure is applied, allowing the crystal tips to all line up so they are level with the part being polished. This technology provides a more brilliant, consistent finish.
Ultra-Flex technology reduces crystal fracturing making it a long-lasting, high quality abrasive like no other on today's market. It also reduces heat generation that can wear out the abrasive crystals and cause orange peel, pitting or other surface imperfections in the part being polished.
Micro-Mesh® is what we like to call a non-abrasive abrasive. It is considered a cushioned abrasive in fact.
Conventional sandpaper is designed to be aggressive so that it will dig deeply. In its manufacture the crystals are electrically charged so that they will stand up. They are locked into a hard resin and when you apply the paper to a surface it will literally tear in and remove the substrate of the material you are sanding. The crystals cut in a negative raking motion, leaving inconsistent scratch patterns.
Micro-Mesh® does the opposite. The backing is long lasting cloth to which an ultra-flexible cushioning layer is applied. This cushioning layer will determine how far forward you can push crystals before they will penetrate the cushioning layer. On top of this layer, we have a very resilient glue, not a hard resin, but a completely flexible glue that will hold the crystals while allowing it to move and rotate. The crystals can turn in any direction without coming loose. When you start to apply pressure to sand with Micro-Mesh®, the crystals will go into the cushioning layer while beginning to cut a bit. If you push harder, they will go further into the cushioning layer, which serves as a safety valve. It determines how much pressure you can exert in a downward direction. Instead of a deep scratch that sandpaper makes, Micro-Mesh® produce a refined scratch that is close to a RMS of 1.0. The cushioning layer also allows the crystals to cut with a planing motion that leaves an extremely consistent scratch pattern and allows you to achieve extraordinary levels of gloss.
Where conventional abrasives will take surfaces down 2 or 3 thousandths (.002 or .003), Micro-Mesh® will take it down one ten thousandth (.0001) or less.
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